Since the CMP process was first applied to semiconductor device production in 1980, we have accumulated many achievements and a great deal of knowledge as a leading company in polishing pads. At present, our product lineup includes slurries and conditioners as well as a wide variety of pads. We are positioned for speedy handling of wide variety of customer requests.
CMP pad
Introducing pads optimized to customer requests, with the de facto standard IC1000™, the VisionPad™ series which performs excellent defect performance, and the Ikonic™ series which is targeting advanced processes below 28nm node.
CMP slurry
We offer slurries suited to all needs, including the ILD™3000/ ILD™4000 series (fumed silica) for oxide, the Wolflat™ series (high selectivity, non selectivity) for tungsten, and the Acuplane™ series for Cu barriers.
Diamond conditioner (KINIK Inc.)
We offer diamond conditioner from KINIK Company in Taiwan. It delivers high performance through KINIK's advanced bonding technologies and diamond arrangement technologies.
