Several hundred process steps are needed for semiconductor device (memory, CPU etc.) manufacturing.
The CMP is a newly necessary process in each key process step, and it becomes more important in advanced processes that are trending toward higher density in a vertical direction.
Furthermore, CMP process have been applied for wafer thinning process (backside polishing) after grinding. This means CMP is now expanding into the packaging process area as well.

Circuit design

Silicon wafer

Pattern design

Film deposition

Photo mask making

Patterning

Photoresist coating

Ashing / Cleaning

Exposure

Development / Etching

Shallow Trench Isolation (STI)

Gate process

Contact process

Interconnect process

Post-process

Complete

CMP process

At NITTA DuPont, we have the three Imperial Regalia for the CMP process; “pads”, “slurries” and “conditioners”. This combination offering can deliver a total solution that can be done only by NITTA DuPont.