Only NITTA DuPont has a full lineup for pads, slurries and conditioners, which enables us to provide total solutions for each customer’s needs.
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We have experienced and knowledgeable staff, who have dedicated many years to research and development of polishing materials and polishing processes, to be able to cover all areas.
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Well-funded R&D capabilities and new infrastructure enable maintenance of leadership positions and ability to meet customer demands.
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As customer’s request, we can offer polishing demonstrations with customers at our Kyoto technical center.
With Class 1000, 100 and 10 clean rooms, we can meet any customer needs from polishing/cleaning to measurement such as for silicon wafers, semiconductor device wafers and compound wafers.
Polishing tool and measurement system
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Polisher for Si wafer
Double side polisher (DSM series by SpeedFam Company Ltd), Single side polisher (SPP, PNX series by Okamoto Machine Tool Works, Ltd) etc. -
Polisher for semiconductor device wafer (CMP)
Ebara EPO, FREX series etc. -
Wafer Measuring Tool
Wafer Surface Inspection Tool (MAGICS by Lasertec Corporation)
Film Thickness Measuring Tool (VM series by SCREEN) etc
We conduct a polishing demo with customers. Our application engineers can discuss with customers directly while reviewing polishing results here, which can give both of us better understandings for a quick decision on the next action. This type of application engineering support is also one of our values that we want to deliver to the customers.
