Our lineup includes foamed polyurethane pads, nonwoven pads, and suede pads. We have products for use in diverse applications, such as products for semiconductor devices, silicon wafers, compound wafers, glass substrates, and more.
We fuse our special foaming technologies with technologies we have developed through our experience with silicon wafers to achieve the highest level of polishing performance. Furthermore, ever since chemical mechanical polishing (CMP) first began being used in semiconductor device manufacturing in 1980, we've been building up an extensive track record and a wealth of knowledge as a polishing pad leader.
Our IC1000™ Series is a CMP industry standard. These products are now being used in a wide range of CMP applications. The compositions of these products are uniform, but we’ve been improving their quality and uniformity for over two decades.
Debug
工程
Cuバルク ・ タングステン ・ STI ・ 酸化膜 ・ Buff ・ ポリシリコン
機能
段差解消性 ・ 高研磨レート
The VisionPad™ series is a pad platform designed for use with CMP. It has multiple uses and supports state-of-the-art nodes. Optimized pore sizes and unique polymer chemistry, including porosity, are used to supply a wide range of polishing characteristic options to meet customers’ process requirements.
Debug
工程
Cuバルク ・ タングステン ・ STI ・ 酸化膜 ・ Buff ・ ポリシリコン
機能
ウェーハ欠陥低減 ・ 段差解消性 ・ 高研磨レート
The Ikonic™ Series is a revolutionary CMP pad platform that has multiple uses and supports state-of-the-art nodes. The cutting-edge CMP polishing pad technologies used in this series combines a range of pad hardnesses and varying porosities to create easily adjustable pad surfaces. They are designed to reduce the frequency of wafer defects, improve polishing efficiency and flatness, and improve process costs for customers.
Debug
工程
Cuバルク ・ タングステン ・ STI ・ 酸化膜 ・ Buff ・ ポリシリコン ・ STI/セリア ・ Cuバリア
機能
ウェーハ欠陥低減 ・ 低エロージョン ・ 段差解消性 ・ 高研磨レート
The EXTERION™ Series is the next-generation successor to the MH™ Series. It contributes to improved quality for a wide range of applications, including the latest wafer manufacturing processes.
Debug
工程
一次研磨
機能
ウェーハ欠陥低減 ・ ウェーハ端部平坦性 ・ 高研磨レート
The MH™ Series of polyurethane pads are the product of our exceptional foaming control technologies. They are primarily used for silicon wafer stock polishing and semi-final polishing. They help provide a high level of planarization polishing for wafers such as 200 mm and 300 mm wafers.
Debug
工程
一次研磨
機能
コスト低減
The Suba™ Series of polishing pads with nonwoven bases are primarily used for silicon wafer stock polishing, semi-final polishing, and final polishing. These pads stand out for their high removal rate, high level of flatness, and low defectivity. They can be used with various wafers, such as GaAs, InP, LiTaO3, and LiNbO3 wafers.
Debug
工程
エッジ研磨工程 ・ 一次研磨
機能
ウェーハ端部平坦性 ・ ウェーハ端部形状追従性 ・ 高研磨レート
The Suba™ Series of polishing pads with nonwoven bases are primarily used for silicon wafer stock polishing, semi-final polishing, and final polishing. These pads stand out for their high removal rate, high level of flatness, and low defectivity. They can be used with various wafers, such as GaAs, InP, LiTaO3, and LiNbO3 wafers.
Debug
工程
仕上げ研磨 ・ 二次研磨 ・ 一次研磨
機能
ウェーハ欠陥低減 ・ ウェーハ端部平坦性
The Suba™ Series of polishing pads with nonwoven bases are primarily used for silicon wafer stock polishing, semi-final polishing, and final polishing. These pads stand out for their high removal rate, high level of flatness, and low defectivity. They can be used with various wafers, such as GaAs, InP, LiTaO3, and LiNbO3 wafers.
Debug
工程
エッジ研磨工程 ・ 仕上げ研磨 ・ 二次研磨 ・ 一次研磨
機能
ウェーハ欠陥低減 ・ ウェーハ端部平坦性 ・ ウェーハ端部形状追従性 ・ 高研磨レート
The Supreme™ Series is a soft pad industry standard. Products in this series are used for CMP Cu barriers and buffing.
Debug
工程
Buff ・ 仕上げ研磨
機能
コスト低減 ・ バッチ間安定性 ・ 高研磨レート
The Optivision™ Series is DuPont and NITTA DuPont’s second generation series of soft pads for use in CMP. The series was designed to improve on the performance of the Supreme™ Series and lower ownership costs.
Debug
工程
Buff ・ Cuバリア
機能
ウェーハ欠陥低減 ・ コスト低減 ・ 高研磨レート
Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.
IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.
Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.
DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.
