Supreme™ Series

The Supreme™ Series is a soft pad industry standard. Products in this series are used for CMP Cu barriers and buffing.

Application
Semiconductor/Silicon wafer/other

Supreme™ RN-H

Application
Semiconductor/Silicon wafer/other
Process
Buff ・ Final polishing
Function
High removal rate

Supreme™ RN-R

Application
Semiconductor/Silicon wafer/other
Process
Buff ・ Final polishing
Function
Cost reduction ・ Batch-to-batch stability

(01) Polishing Pad

Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.

IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.

Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.

DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.

Other
Products

Products