Suba™ Series

The Suba™ Series of polishing pads with nonwoven bases are primarily used for silicon wafer stock polishing, semi-final polishing, and final polishing. These pads stand out for their high removal rate, high level of flatness, and low defectivity. They can be used with various wafers, such as GaAs, InP, LiTaO3, and LiNbO3 wafers.

Application
Silicon wafer ・ Silicon wafer/other

Suba™400 125mil

Application
Silicon wafer
Process
Edge polishing process
Function
High removal rate ・ Wafer edge shape conformability

Suba™400

Application
Silicon wafer/other
Process
Final polishing ・ Semi-final polishing
Function
Wafer defect reduction

Suba™400H

Application
Silicon wafer/other
Process
Semi-final polishing
Function
Wafer defect reduction

Suba™600

Application
Silicon wafer/other
Process
Stock polishing
Function
wafer edge flatness ・ High removal rate

Suba™800

Application
Silicon wafer/other
Process
Stock polishing
Function
wafer edge flatness ・ High removal rate

Suba™800M2

Application
Silicon wafer
Process
Stock polishing
Function
wafer edge flatness ・ High removal rate

Suba™3000

Application
Silicon wafer
Process
Stock polishing
Function
wafer edge flatness ・ High removal rate

(01) Polishing Pad

Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.

IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.

Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.

DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.

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