Ikonic™ Series

The Ikonic™ Series is a revolutionary CMP pad platform that has multiple uses and supports state-of-the-art nodes. The cutting-edge CMP polishing pad technologies used in this series combines a range of pad hardnesses and varying porosities to create easily adjustable pad surfaces. They are designed to reduce the frequency of wafer defects, improve polishing efficiency and flatness, and improve process costs for customers.

Application
Semiconductor

Ikonic™4121H

Application
Semiconductor
Process
Cu bulk ・ Tungsten ・ STI
Function
High removal rate ・ Low erosion ・ Wafer defect reduction

Ikonic™4140H

Application
Semiconductor
Process
Oxidization layer ・ STI/Ceria ・ Tungsten ・ Polysilicon
Function
High removal rate ・ Low erosion ・ Wafer defect reduction

Ikonic™4250H

Application
Semiconductor
Process
Cu bulk ・ Tungsten ・ STI ・ Polysilicon
Function
High removal rate ・ Step height reduction ・ Wafer defect reduction

Ikonic™2010H

Application
Semiconductor
Process
Cu barrier ・ Buff
Function
Wafer defect reduction

Ikonic™2060H

Application
Semiconductor
Process
Cu barrier ・ Buff
Function
Wafer defect reduction

(01) Polishing Pad

Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.

IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.

Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.

DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.

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Products

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