VisionPad™ Series

The VisionPad™ series is a pad platform designed for use with CMP. It has multiple uses and supports state-of-the-art nodes. Optimized pore sizes and unique polymer chemistry, including porosity, are used to supply a wide range of polishing characteristic options to meet customers’ process requirements.

Application
Semiconductor

VisionPad™6000

Application
Semiconductor
Process
Cu bulk ・ Tungsten ・ STI ・ Oxidization layer
Function
High removal rate ・ Wafer defect reduction

VisionPad™7480

Application
Semiconductor
Process
Cu bulk ・ Tungsten ・ STI ・ Oxidization layer ・ Buff ・ Polysilicon
Function
High removal rate ・ Wafer defect reduction

VisionPad™9280

Application
Semiconductor
Process
Cu bulk
Function
High removal rate ・ Wafer defect reduction

VisionPad™5000

Application
Semiconductor
Process
Tungsten ・ STI ・ Oxidization layer
Function
High removal rate ・ Step height reduction ・ Wafer defect reduction

(01) Polishing Pad

Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.

IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.

Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.

DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.

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