We have a wide-ranging lineup of polishing slurries for use in diverse applications. In addition to products for silicon wafer stock polishing, semi-final polishing, final polishing, and edge polishing; products for compound wafer sapphire polishing, lithium tantalate polishing, and lithium niobate polishing; and products for glass substrates, we also have products for use with oxidization layers, tungsten, Cu barriers, and more.
Through synergy with our polishing pads, for which we have the world’s top market share, we enable the creation of optimal surfaces with an exceptional level of flatness and uniformity.
The Nanopure™ Series of polishing slurry is used for silicon wafer stock polishing, semi-final polishing, final polishing, and edge polishing. These slurries offer stable, exceptional polishing performance, including a high level of flatness, low defectivity, and high productivity.
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工程
Cuバルク ・ ポリシリコン
機能
高選択性 ・ ウェーハ欠陥低減 ・ 高研磨レート
The Nanopure™ Series of polishing slurry is used for silicon wafer stock polishing, semi-final polishing, final polishing, and edge polishing. These slurries offer stable, exceptional polishing performance, including a high level of flatness, low defectivity, and high productivity.
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工程
ポリシリコン ・ 一次研磨
機能
超高研磨レート
The Nanopure™ Series of polishing slurry is used for silicon wafer stock polishing, semi-final polishing, final polishing, and edge polishing. These slurries offer stable, exceptional polishing performance, including a high level of flatness, low defectivity, and high productivity.
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工程
仕上げ研磨 ・ 二次研磨 ・ 一次研磨 ・ DSPリンス ・ エッジ研磨
機能
ウェーハ端部高平坦性 ・ 自然酸化膜除去効率性 ・ エッジ形状最適化 ・ 不純物金属低減 ・ ウェーハ欠陥低減 ・ ウェーハ表面粗さ低減 ・ コスト低減 ・ 高研磨レート
The Nanopure™ Series of polishing slurry is used for silicon wafer stock polishing, semi-final polishing, final polishing, and edge polishing. These slurries offer stable, exceptional polishing performance, including a high level of flatness, low defectivity, and high productivity.
Debug
工程
Cuバルク ・ ポリシリコン ・ 仕上げ研磨 ・ 二次研磨 ・ 一次研磨 ・ DSPリンス ・ エッジ研磨
機能
ウェーハ端部高平坦性 ・ 超高研磨レート ・ 自然酸化膜除去効率性 ・ エッジ形状最適化 ・ 不純物金属低減 ・ 高選択性 ・ ウェーハ欠陥低減 ・ ウェーハ表面粗さ低減 ・ コスト低減 ・ 高研磨レート
The Machplaner™ Series is used for the polishing of compounds such as sapphire compounds and for polishing oxidized substrates such as LiTaO3 substrates or LiNbO3 substrates. Thanks to their optimal grain composition, they produce high removal rates and high surface quality.
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工程
仕上げ研磨 ・ 一次研磨
機能
低摩擦抵抗 ・ 高選択性 ・ ウェーハ表面粗さ低減 ・ 高研磨レート
In the high quality ILD™ Series, exceptional dispersion technologies are used to stabilize the performance of fumed silica abrasive. This series improves customer processes thanks to its high quality, low defect performance and its high polishing efficiency.
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工程
酸化膜
機能
ウェーハ欠陥低減 ・ 高研磨レート
The Acuplane™ Series lineup consists of products for use with Cu barriers with adjustable selectivity and TSV. They have predictable properties when used in semiconductor logic or memory production processes, and are provided for use in production for both mature device nodes and advanced device nodes.
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工程
Cuバリア ・ TSV
機能
コスト低減 ・ 高研磨レート
The Novaplane™ Series lineup consists of tungsten (W) slurries with high polishing efficiency and adjustable selectivity. They meet customer needs for tungsten CMP thanks to their exceptional flatness and low defectivity properties and the cost reductions they offer customers.
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工程
タングステン
機能
コスト低減 ・ 段差解消性 ・ 高研磨レート
Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.
IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.
Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.
DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.
