LK393C4
- Application
- Semiconductor
- Process
- Cu barrier ・ TSV
- Function
- High removal rate ・ Cost reduction
- TOP
- Products
- PolishingSlurry
- Acuplane™ Series
Acuplane™ Series
The Acuplane™ Series lineup consists of products for use with Cu barriers with adjustable selectivity and TSV. They have predictable properties when used in semiconductor logic or memory production processes, and are provided for use in production for both mature device nodes and advanced device nodes.
LK393C4
(02) Polishing Slurry
Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.
IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.
Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.
DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.
