NITTA DuPont Incorporated

Our lineup includes foamed polyurethane pads, nonwoven pads, and suede pads. We have products for use in diverse applications, such as products for semiconductor devices, silicon wafers, compound wafers, glass substrates, and more.
We fuse our special foaming technologies with technologies we have developed through our experience with silicon wafers to achieve the highest level of polishing performance. Furthermore, ever since chemical mechanical polishing (CMP) first began being used in semiconductor device manufacturing in 1980, we've been building up an extensive track record and a wealth of knowledge as a polishing pad leader.

We have a wide-ranging lineup of polishing slurries for use in diverse applications. In addition to products for silicon wafer stock polishing, semi-final polishing, final polishing, and edge polishing; products for compound wafer sapphire polishing, lithium tantalate polishing, and lithium niobate polishing; and products for glass substrates, we also have products for use with oxidization layers, tungsten, Cu barriers, and more.
Through synergy with our polishing pads, for which we have the world’s top market share, we enable the creation of optimal surfaces with an exceptional level of flatness and uniformity.

NITTA DuPont provides comprehensive polishing solutions for ultra-precision surface polishing through our lineup of polishing consumables such as polishing pads, polishing slurries, fixturing products, and conditioners.
Our Template Assembly fixturing products affix silicon and other wafers to polishing heads without the use of wax. Our DiaGrid® Series of conditioners produces exceptional conditioning performance, especially for hard foamed polyurethane pads.