Fixturing (backing material)

Our fixturing (backing material) products are used to affix wafers to polishing machine carrier plates without the use of wax. They aid in producing flatter wafers and substrates as well as improving productivity through automation. They are available in a wide range of sizes and materials, so we can provide fixturing that is matched to customer needs.

Application
Semiconductor/Silicon wafer/other

R303

Application
Semiconductor/Silicon wafer/other
Process
Fixing the wafer to the polishing tool
Function
Wafer chucking capability ・ Chemical resistance

R305

Application
Semiconductor/Silicon wafer/other
Process
Fixing the wafer to the polishing tool
Function
Wafer chucking capability ・ High adsorption

R601

Application
Semiconductor/Silicon wafer/other
Process
Fixing the wafer to the polishing tool
Function
Wafer chucking capability

R703

Application
Semiconductor/Silicon wafer/other
Process
Fixing the wafer to the polishing tool
Function
Wafer chucking capability ・ Excellent flatness

(03) Conditioner / Fixturing

Supreme™, MH™, EXTERION™, ILD™, Nanopure™ and Machplaner™ are trademarks of NITTA DuPont Incorporated.

IC1000™ is a trademark or service mark of NITTA DuPont Incorporated or affiliates of DuPont de Nemours, Inc.

Suba™, VisionPad™, Ikonic™, Optivision™, Acuplane™, Optiplane™ and Novaplane™ are trademarks, service marks or registered trademarks of affiliates of DuPont de Nemours, Inc.

DiaGrid ® and Pyradia ® are registered trademarks of KINIK Company.

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